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 HiPerFETTM Power MOSFETs
Single MOSFET Die
IXFK 24N100 IXFX 24N100
VDSS ID25
RDS(on)
= 1000 V = 24 A = 0.39
trr 250 ns
Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD TJ TJM Tstg TL Md Weight
Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 M Continuous Transient TC = 25C TC = 25C, Note 1 TC = 25C TC = 25C TC = 25C IS IDM, di/dt 100 A/s, VDD VDSS TJ 150C, RG = 2 TC = 25C
Maximum Ratings 1000 1000 20 30 24 96 24 60 3 5 560 -55 ... +150 150 -55 ... +150 300 0.9/6 V V V V A A A mJ J V/ns W C C C C Nm/lb.in. 6 10 g g
PLUS 247TM (IXFX)
G
D (TAB) D
TO-264 AA (IXFK)
G
D
(TAB)
S
G = Gate S = Source
D = Drain TAB = Drain
1.6 mm (0.063 in.) from case for 10 s Mounting torque TO-264 PLUS 247 TO-264
Features l International standard packages l Low RDS (on) HDMOSTM process l Rugged polysilicon gate cell structure l Unclamped Inductive Switching (UIS) rated l Low package inductance - easy to drive and to protect l Fast intrinsic rectifier
Symbol
Test Conditions
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 1000 3.0 V 5.0 V 100 nA TJ = 25C TJ = 125C 100 A 2 mA 0.39
VDSS VGS(th) IGSS IDSS RDS(on)
VGS = 0 V, ID = 3mA VDS = VGS, ID = 8mA VGS = 20 V, VDS = 0 VDS = VDSS VGS = 0 V VGS = 10 V, ID = 0.5 * ID25 Note 2
Applications l DC-DC converters l Battery chargers l Switched-mode and resonant-mode power supplies l DC choppers l AC motor control l Temperature and lighting controls
Advantages PLUS 247TM package for clip or spring mounting l Space savings l High power density
l
(c) 2002 IXYS All rights reserved
98598B (8/02)
IXFK 24N100 IXFX 24N100
Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. Note 2 15 22 7000 VGS = 0 V, VDS = 25 V, f = 1 MHz 750 260 35 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 RG = 1 (External), 35 75 21 250 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 55 135 0.22 0.15 S pF pF pF ns ns ns ns nC nC nC K/W K/W
Dim. A A1 A2 b b1 b2 C D E e L L1 Q R
Terminals: 1 - Gate 2 - Drain (Collector) 3 - Source (Emitter) 4 - Drain (Collector)
PLUS 247TM Outline
gfs Ciss Coss Crss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCK
VDS = 10 V; ID = 0.5 * ID25
Source-Drain Diode Symbol IS ISM VSD t rr QRM IRM Test Conditions VGS = 0 V Repetitive; pulse width limited by TJM IF = IS, VGS = 0 V, Note 1
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 24 96 1.5 250 A A V ns C A
Millimeter Min. Max. 4.83 5.21 2.29 2.54 1.91 2.16 1.14 1.40 1.91 2.13 2.92 3.12 0.61 0.80 20.80 21.34 15.75 16.13 5.45 BSC 19.81 20.32 3.81 4.32 5.59 6.20 4.32 4.83
Inches Min. Max. .190 .205 .090 .100 .075 .085 .045 .055 .075 .084 .115 .123 .024 .031 .819 .840 .620 .635 .215 BSC .780 .800 .150 .170 .220 0.244 .170 .190
TO-264 AA Outline
IF = IS, -di/dt = 100 A/s, VR = 100 V
1.0 8
Dim.
Note: 1. Pulse width limited by TJM 2. Pulse test, t 300 s, duty cycle d 2 %
Millimeter Min. Max. 4.82 5.13 2.54 2.89 2.00 2.10 1.12 1.42 2.39 2.69 2.90 3.09 0.53 0.83 25.91 26.16 19.81 19.96 5.46 BSC 0.00 0.25 0.00 0.25 20.32 20.83 2.29 2.59 3.17 3.66 6.07 6.27 8.38 8.69 3.81 4.32 1.78 2.29 6.04 6.30 1.57 1.83
Min.
Inches Max.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,850,072 4,881,106 4,931,844
A A1 A2 b b1 b2 c D E e J K L L1 P Q Q1 R R1 S T
.190 .202 .100 .114 .079 .083 .044 .056 .094 .106 .114 .122 .021 .033 1.020 1.030 .780 .786 .215 BSC .000 .010 .000 .010 .800 .820 .090 .102 .125 .144 .239 .247 .330 .342 .150 .170 .070 .090 .238 .248 .062 .072
5,017,508 5,034,796
5,049,961 5,063,307
5,187,117 5,237,481
5,486,715 5,381,025
IXFK 24N100 IXFX 24N100
20
TJ = 25C VGS = 8-10V 7V
50 40
TJ = 25C
VGS = 10V 9V 8V
7V
15
ID - Amperes
ID - Amperes
6V
30 20
6V
10
5
5V
10 0
5V
0
0
2
4
6
8
10
0
5
10
15
20
25
VDS - Volts
VCE - Volts
Fig.1 Output Characteristics @ Tj = 25C
20 16
Fig.2 Extended Output Characteristics @ Tj = 25C
20
TJ = 125C VGS = 10V 9V 8V
7V 6V
15
ID - Amperes
12 8 4
5V
ID - Amperes
10
TJ = 125OC TJ = 25OC
5
0
0
4
8
12
16
20
0
3
4
5
6
7
8
VDS - Volts
VGS - Volts
Fig.3 Output Characteristics @ Tj = 25C
Fig.4 Drain Current vs Gate Source Voltage
2.4 2.2 RDS(ON) - Normalized 2.0 1.8 1.6 1.4 1.2 1.0 0.8 25 50 75 100 125 150
ID = 24A VGS = 10V
ID = 12A
TJ - Degrees C
Fig.5 Temperature Dependence of Drain-to-
IXFK 24N100 IXFX 24N100
15 12
VDS = 500 V ID = 12 A IG = 10 mA
20000
10000
Ciss
Capacitance - pF
f = 1MHz
VGS - Volts
9 6 3 0
Coss
1000
Crss
100 0 50 100 150 200 250 300 350
0
5
10
15
20
25
30
35
40
Gate Charge - nC
VDS - Volts
Fig. 6 Gate Charge Characteristic
50 30 25 20 15 10 5
Fig. 7 Capacitance Curves
40
ID - Amperes
30
TJ = 125oC TJ = 25oC
20
10
0
ID - Amperes
2.5
0.0
0.5
1.0
1.5
2.0
0 -50
-25
0
25
50
75
100
125
150
VSD - Volts
Case Temperature - oC
Fig. 8 Drain Current vs Drain to Source Voltage
0.300 0.100
Fig. 9 Drain Current vs Case Temperature
R(th)JC - K/W
0.010
0.001 10-4
10-3
10-2
10-1
100
101
Pulse Width - Seconds
Fig.10 Transient Thermal Resistance


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